3D@Home Releases New Technology Features To Interactive 3D Eco-System Tool Set
SAN JOSE, Calif., April 25, 2012 /PRNewswire/ -- 3D@Home Consortium today announces the public availability of the 3D Eco-System Metadata Chart and 3D Technology Matrix as content-rich additions to the 3D Eco-System Diagram, a Flash®-based, online, interactive diagram.  Designed to assist professionals in the broadcast, distribution, display, and electronics industries better understand and explain the implementation path for stereoscopic 3D, the diagram has the advantage of being easily-navigable and freely available for presentation or for personal perusal.  To view the diagrams, visit or go to www.3DatHome.org and click on the 3D Eco-System diagram graphic in the middle of the page.  T ...

Gameloft and LG Present New and Evolved 3D Mobile Gaming Experiences
PARIS, March 20, 2012 /PRNewswire/ -- High-quality games are combined on LG Optimus 3D MAX withpowerful 3D technology and sleeker design for a 3D mobile gaming experience Gameloft®, a leading global publisher of digital and social games, and LG Electronics (LG), one of the top technological innovators in the field of mobile communications in the world, announced their new collaboration aiming to optimize several Gameloft video games for the new LG Optimus 3D Max smartphone. Assassin's Creed 3D, Dungeon Hunter 2 3D, James Cameron's Avatar 3D, N.O.V.A.

Legend3D Opens Its Doors at Hollywood Center Studios
SAN DIEGO, April 2, 2012 /PRNewswire/ -- Legend3D, Inc., a leading digital media technology and visual effects company and innovator in 3D storytelling, today announced that it has relocated its Los Angeles office to Bungalow A at Hollywood Center Studios.

Three-dimensional Integrated Circuit (3D IC/Chip) & Through-Silicon Via (TSV) Interconnects Market - Global Forecast & Trend Analysis (2011 - 2016)
NEW YORK, April 11, 2012 /PRNewswire/ -- Reportlinker.com announces that a new market research report is available in its catalogue: Three-dimensional Integrated Circuit (3D IC/Chip) & Through-Silicon Via (TSV) Interconnects Market - Global Forecast & Trend Analysis (2011 - 2016) Three-dimensional Integrated Circuit (3D IC/Chip) & Through-Silicon Via (TSV) Interconnects Market - Global Forecast & Trend Analysis (2011 - 2016) 3D IC/Chip & TSV In ...

Legend3D Appoints New Chief Operating Officer and Chief Financial Officer
SAN DIEGO, March 7, 2012 /PRNewswire/ -- Legend3D, Inc., the leading innovator in 2D-to-3D conversion technology, today announced that Tom Sinnott will now serve as chief operating officer (COO) and Steven Wolkenstein will take the role of chief financial officer (CFO), effective immediately.